Hua'ōlelo pilikino: He mea nui loa kāu pilikino iā mākou.ʻO kā mākou hui pū e hoʻolaha i kāuʻike pilikino i kekahi mauʻaeʻia.
Hoʻohālike No.: NS08GU4E8
Nā kaʻa: Ocean,Land,Air,Express
ʻO keʻano o ka uku: L/C,T/T,D/A
ʻO Incoterm: FOB,CIF,EXW
8GB 26666MHZ 288-PIN DDR4 UDIMM
Hōʻike Hoʻomaopopo
Revision No. |
History |
Draft Date |
Remark |
1.0 |
Initial Release |
Apr. 2022 |
|
Ke kauoha nei i ka Papa Pūnaewele
Model |
Density |
Speed |
Organization |
Component Composition |
NS08GU4E8 |
8GB |
2666MHz |
1Gx64bit |
DDR4 1Gx8 *8 |
ʻO ka weheweheʻana
Uaʻaeʻo Hengstar i nā ddr4 sdram sdram (unbuffed iʻelua mau modula e hoʻohana ai i nā modules hoʻomanaʻo. NS08G4E8 kahi 1G x 64-bit i hoʻokahi papa inoa inoaʻo 8GB DDR4-26666 ma luna oʻewalu mau makahiki heʻewalu. Hoʻonohonohoʻia ka spd i ka jeducge standard tandard ddr4-2666 Timing of 19-19-19 ma 1.2V. Ua hoʻohanaʻo kēlā me kēia 288-PIN Timm i nā manamana lima gula gula gula. Kuhiʻia ka DEMM i ka DIMM i manaʻoʻia no ka hoʻohanaʻana i ke hoʻomanaʻo nui inā hoʻokomoʻia i nā'ōnaehana e like me nā PC a me nā hana hana.
Nā hiʻohiʻona
POMITUM: VDD = 1.2V (1.14V a i 1.26V)
VDDQ = 1.2V (1.14V a 1.26V)
vpt - 2.5V (2.375V a 2.75V)
vdddspd = 2.25V a 3.6v
nominal a me Dinamic i ka pauʻana o ka pauʻana (odt) no kaʻikepili, strobe, a me nā hōʻailona hōʻailona
We-mana o ka home e hōʻoluʻolu (lpasr)
data kaʻa kaʻa kaʻa (DBI) no nā kaʻa data
ON-DEAM VREFDQ LIGET a me Calbration
ON-CLADE I2C Serval Ove-Searct (SPD) EEPROM
Ten16 mau waihona kūloko; 4 mau hui o 4 mau mile i kēlā me kēia
Fixed Burst Chop
secleble bc4 or bl8 on-the-fly (otf)
Datababus e kākau iā cyclic redundancy loiloi (crc)
TEMPEPERRAIR MOUP (TCR)
CCOMMITM / Address (CA)
Ua kākoʻoʻia ke kākoʻoʻo per Dram
8 bit mua-fetch
fly-by topology
CCOMMITMS / Address Latency (Cal)
ʻO ke kauoha a ka mana a me ka hoʻokele a me ke kaʻa
PCB: Ke kiʻekiʻe 1.23 "(31.25mm)
GelD Edge
ROHS kūpono a me halgegen-free
Ke kīʻana i nā pākuʻi
MT/s |
tCK |
CAS Latency |
tRCD |
tRP |
tRAS |
tRC |
CL-tRCD-tRP |
DDR4-2666 |
0.75 |
19 |
14.25 |
14.25 |
32 |
46.25 |
19-19-19 |
Hale Kūʻai
Configuration |
Number of |
Bank Group |
Bank |
Row Address |
Column |
Page size |
8GB(1Rx8) |
4 |
BG0-BG1 |
BA0-BA1 |
A0-A15 |
A0-A9 |
1 KB |
Pūnaewele Pūnaewele
8GB, 1GX64 module (1rank o x8)
Nā helu kiʻekiʻe loa
Nā helu helu DC kiʻekiʻe loa
Symbol |
Parameter |
Rating |
Units |
NOTE |
VDD |
Voltage on VDD pin relative to VSS |
-0.3 ~ 1.5 |
V |
1,3 |
VDDQ |
Voltage on VDDQ pin relative to VSS |
-0.3 ~ 1.5 |
V |
1,3 |
VPP |
Voltage on VPP pin relative to VSS |
-0.3 ~ 3.0 |
V |
4 |
VIN, VOUT |
Voltage on any pin except VREFCA relative to VSS |
-0.3 ~ 1.5 |
V |
1,3,5 |
TSTG |
Storage Temperature |
-55 to +100 |
°C |
1,2 |
Hoʻokomoʻia ka hana i ka pae hana
Symbol |
Parameter |
Rating |
Units |
Notes |
TOPER |
Normal Operating Temperature Range |
0 to 85 |
°C |
1,2 |
Extended Temperature Range |
85 to 95 |
°C |
1,3 |
ʻO nā kūlana hana AC & DC
Nā Kūlana Kūʻai DC
Symbol |
Parameter |
Rating |
Unit |
NOTE |
||
Min. |
Typ. |
Max. |
||||
VDD |
Supply Voltage |
1.14 |
1.2 |
1.26 |
V |
1,2,3 |
VDDQ |
Supply Voltage for Output |
1.14 |
1.2 |
1.26 |
V |
|
VPP |
Supply Voltage for DRAM Activating |
2.375 |
2.5 |
2.75 |
V |
3 |
Module dimensions
ʻIke mua
Nānā hope
Nā huahana huahana : ʻO nā lako waiwaiʻo Companyrial
Hua'ōlelo pilikino: He mea nui loa kāu pilikino iā mākou.ʻO kā mākou hui pū e hoʻolaha i kāuʻike pilikino i kekahi mauʻaeʻia.
E hoʻopihapiha i nāʻike hou aku no laila e hiki ke hoʻopili pū meʻoe wikiwiki
Hua'ōlelo pilikino: He mea nui loa kāu pilikino iā mākou.ʻO kā mākou hui pū e hoʻolaha i kāuʻike pilikino i kekahi mauʻaeʻia.